RD SERIES BGA/SMT REWORK MACHINES
FOR STABLE AND SAFE REWORK
HIGH PERFORMANCE 3 POINT HEATING SYSTEM FOR LEAD FREE REWORK
Both the RD-500III and the RD-500SIII feature 700 watt upper and lower hot air heaters. By delivering hot air simultaneously from above and below, these units are able to evenly heat the component and solder connections. This results in much safer removal and placement heating profiles. In addition, the RD-500III comes standard with an IR area heater. The RD-500III area heater uses a series of 6 rod type heating elements. Each provides 400 watts of heating power for a combined 2400 watts. This is enough to heat the largest of PCBs evenly in order to prevent the PCB from warping while removing or replacing the component. The RD-500SIII has an optional area heater with 3 rod type heaters for a total of 1200 watts. This is sufficient for the board that is more common to this unit.
![]() Upper Hot Air Heater ( 700W ) Lower Hot Air Heater ( 700W ) and Area Heater ( 2400W ) of RD-500III |
![]() Upper Hot Air Heater ( 700W ) Lower Hot Air Heater ( 700W ) and Area Heater ( 1200W ) of RD-500SIII |
2 POINT COOLING SYSTEM
The RD-500III and RD-500SIII machines cool the component by two means. The primary method is by
turning the heaters off after the heating profile and blowing air through the heating element.
The second method is with a cooling fan. After the heating cycle is complete, the heater head
raises about 50 millimeters from the board and a fan that is pointed at the reflow point is turned on.
Additional cooling such as this has shown to improve lead free solder connections.
This second cooling can be turned on by choosing an odd number in the Reflow Time. It is turned
off by choosing an even number in the Reflow Time.
DOWNLOAD CATALOG
CATALOG : RD-500III-500SIII.pdf (729KB)



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