DESOLDERING TOOL : SC-7000Z
FEATURES
- Direct connection between the diaphragm pump and the tip can provide high vacuum efficiency which can accommodate for the 8-12 layered PCB.
- The combination of a 100W ceramic heater with sensor feedback temperature control circuit and high vacuum capacity can provide best work efficiency with no failure.
- Protection against ESD is secured.
- Quite compact, light-weight unit portable and ready to use at any location.
- Low noise and low vibration.
- The removal of SMD components can be easily done by a flick of the selector lever and by replacing the tip with the hot blow nozzle.
APPLICATIONSRemoving the solder of DIP by the suction tip
Melting the solder of QFP/SOP by the hot blow for removal
Melting the solder of PLCC by the hot blow for removal
Melting the solder of other SNDsby the hot blow for removal
|
TIME REQUIRED TO REACH THE MAXIMUM VACUUM
OPTION
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SPECIFICATIONS
| Voltage | AC100V, 120V, 230V, 50/60HZ |
|---|---|
| Power Consumption | 120W |
| Pump | Diaphragm type |
| Motor output | 12W |
| Vacuum attained | 650mmHg |
| Time required to reach maximum vacuum | 0.1 seconds |
| Air flow rate | 15 liter/minute ( Open ) |
| Heater | 100W ( Ceramic ) |
| Control System | Feed back zero cross over type |
| Temperature Range | 350C-500 Degree Celcius |
| Insulation resistance | More than 100M |
| Max.Temperature of hot blow | 400Degree Celcius |
| Net weight | 420g |
| Marking | d | D1 | D2 | Lmm | |
|---|---|---|---|---|---|
| 50-01-11 | 0.8 Std | 0.8 | 2.5 | 7.0 | 12.5 |
| 50-01-12 | 0.8 SLIM | 0.8 | 2.0 | 6.0 | 14.0 |
| 50-01-13 | 0.8 U.SLIM | 0.8 | 1.5 | 5.0 | 11.5 |
| 50-01-14 | 1.0 Std | 1.0 | 2.5 | 7.0 | 12.5 |
| 50-01-15 | 1.5 Std | 1.5 | 3.0 | 7.0 | 12.5 |
| 50-01-16 | 1.0 SLIM | 1.0 | 2.0 | 6.0 | 14.0 |
| 50-01-17 | 1.5 SLIM | 1.5 | 2.2 | 6.0 | 14.0S |
DOWNLOAD CATALOG & MANUAL
CATALOG : SC-7000Z.pdf (731KB)
MANUAL : SC-7000Z_M_E.pdf (1.63MB)





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